Hardware Architect and Team Lead

About Us : AI compute is hitting a hard physical wall, and memory bottlenecks are throttling the entire industry. Founded in October 2024 and backed by €57M in funding, Vertical Compute is solving this with proprietary Vertical Integrated Memory (VIM™) chiplets, making AI hardware faster, greener, and vastly more scalable. We are an interdisciplinary team transforming breakthrough semiconductor physics into commercial reality. Why Now : After 18 months of intensive R&D, Vertical Compute has reached a critical inflection point. Our underlying technology is validated, and we have successfully met our core technical milestones. Armed with a proven technical data package and ongoing system studies, we are now shifting from pure R&D to active engagement with global enterprise customers. As we prepare for our next phase of scale and growth starting in 2027, joining us today means taking direct ownership of the hardware foundation that will power the next era of AI compute. About the role: We are looking for a Software Architect & Team Lead to drive the definition, architecture, and delivery of our software stack and AI toolchain for Vertical Compute's 3D-integrated chiplets. In this role, you will be responsible for defining the complete software architecture across all layers—including low-level software, device drivers, AI compiler, and higher-level AI application. You will co-design the software-hardware solution, working in close collaboration with the hardware and memory design teams to optimize AI workloads to demonstrate the full potential of our proprietary Vertical Integrated Memory (VIM™) technology. You will also manage and mentor the software engineering team ensuring efficient development. Key Responsibilities: Software Architecture & System Definition: Define and architect the multi-layer software stack, including device drivers, low-level software, AI compiler/toolchain, and AI application framework interfaces tailored for VIM™ memory technology. Hardware/…

Posted 22 Oct 2026

About Us : AI compute is hitting a hard physical wall, and memory bottlenecks are throttling the entire industry. Founded in October 2024 and backed by €57M in funding, Vertical Compute is solving this with proprietary Vertical Integrated Memory (VIM™) chiplets, making AI hardware faster, greener, and vastly more scalable. We are an interdisciplinary team transforming breakthrough semiconductor physics into commercial reality. Why Now : After 18 months of intensive R&D, Vertical Compute has reached a critical inflection point. Our underlying technology is validated, and we have successfully met our core technical milestones. Armed with a proven technical data package and ongoing system studies, we are now shifting from pure R&D to active engagement with global enterprise customers. As we prepare for our next phase of scale and growth starting in 2027, joining us today means taking direct ownership of the hardware foundation that will power the next era of AI compute. About the role: You will oversee key technical initiatives to deliver our unified hardware and software platform. You will play a crucial role in transitioning products from initial development into commercial production. Taking full ownership of execution, you will bridge technology delivery with strategic commercial goals. Key responsibilities: Own the cross-functional execution framework for complex silicon and software development programs from early architecture through tapeout, post-silicon bring-up, and release. Partner closely with hardware, software, architecture, and product teams to drive alignment on milestones, roadmaps, and execution reviews. Establish scalable execution practices, manage program dependencies, and proactively mitigate risks across hardware and software integration efforts. Manage cross-functional dependencies and program delivery flow to ensure seamless execution. Drive regular program-level product demonstrations to validate milestones and gather stakeholder feedback. Le…

Posted 22 Oct 2026

About Us : AI compute is hitting a hard physical wall, and memory bottlenecks are throttling the entire industry. Founded in October 2024 and backed by €57M in funding, Vertical Compute is solving this with proprietary Vertical Integrated Memory (VIM™) chiplets, making AI hardware faster, greener, and vastly more scalable. We are an interdisciplinary team transforming breakthrough semiconductor physics into commercial reality. Why Now : After 18 months of intensive R&D, Vertical Compute has reached a critical inflection point. Our underlying technology is validated, and we have successfully met our core technical milestones. Armed with a proven technical data package and ongoing system studies, we are now shifting from pure R&D to active engagement with global enterprise customers. As we prepare for our next phase of scale and growth starting in 2027, joining us today means taking direct ownership of the hardware foundation that will power the next era of AI compute. About the role: We are looking for a 3D Integration / Chiplet Expert to define and implement 2.5D/3D advanced packaging solutions for our Vertical Integrated Memory (VIM) technology. You will collaborate across teams to define optimal interconnect strategies and die stacking approaches to enable high-bandwidth, low-power operation. This job sits at the intersection of SoC architecture (specifically the physical design) , package design, and 3D manufacturing processes. Key Responsibilities: Integration Architecture & Process Definition : Develop and define architectures for 2.5D/3D stacking of VIM chiplets with compute chiplets. Collaborate with design and technology teams to develop interconnect solutions that ensure high bandwidth and low latency. Define clearly the impact of the chiplet physical design chiplets (through-silicon vias, micro-bumps, hybrid bonds, redistribution layers, and chiplet interfaces, …) define fabrication flows and design rules with foundries, packaging partners, and internal p…

Posted 22 Oct 2026