Senior Program Manager (Product Development)

About Us : AI compute is hitting a hard physical wall, and memory bottlenecks are throttling the entire industry. Founded in October 2024 and backed by €57M in funding, Vertical Compute is solving this with proprietary Vertical Integrated Memory (VIM™) chiplets, making AI hardware faster, greener, and vastly more scalable. We are an interdisciplinary team transforming breakthrough semiconductor physics into commercial reality. Why Now : After 18 months of intensive R&D, Vertical Compute has reached a critical inflection point. Our underlying technology is validated, and we have successfully met our core technical milestones. Armed with a proven technical data package and ongoing system studies, we are now shifting from pure R&D to active engagement with global enterprise customers. As we prepare for our next phase of scale and growth starting in 2027, joining us today means taking direct ownership of the hardware foundation that will power the next era of AI compute. About the role: We are looking for a Software Architect & Team Lead to drive the definition, architecture, and delivery of our software stack and AI toolchain for Vertical Compute's 3D-integrated chiplets. In this role, you will be responsible for defining the complete software architecture across all layers—including low-level software, device drivers, AI compiler, and higher-level AI application. You will co-design the software-hardware solution, working in close collaboration with the hardware and memory design teams to optimize AI workloads to demonstrate the full potential of our proprietary Vertical Integrated Memory (VIM™) technology. You will also manage and mentor the software engineering team ensuring efficient development. Key Responsibilities: Software Architecture & System Definition: Define and architect the multi-layer software stack, including device drivers, low-level software, AI compiler/toolchain, and AI application framework interfaces tailored for VIM™ memory technology. Hardware/…

Publié 22 Oct 2026

About Us : AI compute is hitting a hard physical wall, and memory bottlenecks are throttling the entire industry. Founded in October 2024 and backed by €57M in funding, Vertical Compute is solving this with proprietary Vertical Integrated Memory (VIM™) chiplets, making AI hardware faster, greener, and vastly more scalable. We are an interdisciplinary team transforming breakthrough semiconductor physics into commercial reality. Why Now : After 18 months of intensive R&D, Vertical Compute has reached a critical inflection point. Our underlying technology is validated, and we have successfully met our core technical milestones. Armed with a proven technical data package and ongoing system studies, we are now shifting from pure R&D to active engagement with global enterprise customers. As we prepare for our next phase of scale and growth starting in 2027, joining us today means taking direct ownership of the hardware foundation that will power the next era of AI compute. About the role: We are looking for a Hardware Architect and Team Lead with strong hardware architecture expertise to lead the definition, architecture, and execution of our next-generation 3D-integrated chiplet products. In this role, you will be responsible for architecting and specifying chiplet products developed by Vertical Compute integrated in 3D, ensuring they leverage our proprietary Vertical Integrated Memory (VIM™) technology to address complex AI computation challenges, collaborating closely with the memory design team and the SW Team in charge of the AI application and AI compiler development. You will own the complete end-to-end hardware engineering lifecycle from architecture definition and specification up to final silicon tape-out and bring-up (architecture, front-end RTL development, verification, DFT, physical implementation, and silicon bring-up), building and leading the internal hardware team. You will coordinate with external design service companies, Research partners and Program…

Publié 22 Oct 2026

About Us : AI compute is hitting a hard physical wall, and memory bottlenecks are throttling the entire industry. Founded in October 2024 and backed by €57M in funding, Vertical Compute is solving this with proprietary Vertical Integrated Memory (VIM™) chiplets, making AI hardware faster, greener, and vastly more scalable. We are an interdisciplinary team transforming breakthrough semiconductor physics into commercial reality. Why Now : After 18 months of intensive R&D, Vertical Compute has reached a critical inflection point. Our underlying technology is validated, and we have successfully met our core technical milestones. Armed with a proven technical data package and ongoing system studies, we are now shifting from pure R&D to active engagement with global enterprise customers. As we prepare for our next phase of scale and growth starting in 2027, joining us today means taking direct ownership of the hardware foundation that will power the next era of AI compute. About the role: We are looking for a 3D Integration / Chiplet Expert to define and implement 2.5D/3D advanced packaging solutions for our Vertical Integrated Memory (VIM) technology. You will collaborate across teams to define optimal interconnect strategies and die stacking approaches to enable high-bandwidth, low-power operation. This job sits at the intersection of SoC architecture (specifically the physical design) , package design, and 3D manufacturing processes. Key Responsibilities: Integration Architecture & Process Definition : Develop and define architectures for 2.5D/3D stacking of VIM chiplets with compute chiplets. Collaborate with design and technology teams to develop interconnect solutions that ensure high bandwidth and low latency. Define clearly the impact of the chiplet physical design chiplets (through-silicon vias, micro-bumps, hybrid bonds, redistribution layers, and chiplet interfaces, …) define fabrication flows and design rules with foundries, packaging partners, and internal p…

Publié 22 Oct 2026